As the development of 5G has become a trend, 5G high-speed optical devices and their heat dissipation devices have also become the focus of attention and discussion. And there is no doubt that tungsten copper heat sink has become the best choice.
Compared with 4G, the download rate of 5G should be increased by at least 9-10 times. In the era of 5G network, no matter what kind of 5G bearer solution is inseparable from 5G communication devices, 5G has higher and higher requirements for optical devices and is small in size. , High integration, high speed, low power consumption, the main commonly used device rates for 5G fronthaul, midhaul and backhaul are 25G, 50G, 100G, 200G and 400G optical devices, of which 25G and 100G optical devices are the most widely used 5G communication devices.
Optical devices are divided into active devices and passive devices. Optical active devices are optoelectronic devices that can convert electrical signals into optical signals or convert optical signals into electrical signals that need to be driven by external energy in optical communication systems. They are optical transmissions. The heart of the system. Optical passive devices are optoelectronic devices that do not require external energy to drive their work.
When the optoelectronic chip is working, it
will not convert 100% of the injected current into output photoelectrons, and
part of it will be used as energy loss in the form of heat. If a large amount
of heat continues to accumulate and cannot be eliminated in time, it will have
many disadvantages to the performance of the components. Generally speaking,
the increase in temperature will reduce the resistance value, reduce the
service life of the device, deteriorate the performance, material aging, and
damage the components; in addition, high temperature will also cause stress and
deformation of the material, reduce reliability, and malfunction of the device.
So when considering the device package structure, thermal design is one of the
most important considerations.
Heat conduction is an important aspect of
material selection. It refers to the heat generated by the thermal motion of
microscopic examples such as molecules, atoms and free electrons when there is
no relative displacement between the various parts of the object, which is
called heat conduction. For example, the chip conducts heat dissipation through
the heat sink underneath, and the optical device contacts the housing through
heat dissipation silicone grease to dissipate heat, etc., which all belong to
heat conduction. The thermal conductivity of different materials is different.
Tungsten copper heat sink is gradually being used more and more widely in 5G
high-speed optical devices because of its high thermal conductivity and low
thermal expansion coefficient.
