In wafer testing, various types of tungsten probes are used to make electrical contact with semiconductor devices on the wafer. The choice of probe type depends on the specific requirements of the testing process.
Here are some common types:
Wire Bonding Probes:
Description: These probes are used for wire bonding applications, where wires are bonded to semiconductor devices for interconnection.
Application: Wire bonding is a common technique in semiconductor packaging, and tungsten wire bonding probes are used to make electrical connections between the chip and the package.
Vertical or Pogo Probes:
Description: These probes have a vertically oriented shaft that allows for vertical movement. They are often spring-loaded (Pogo probes) to provide compliance.
Application: Pogo probes are commonly used in automated testing equipment (ATE). They provide reliable electrical contact while accommodating variations in the wafer surface.
Cantilever Probes:
Description: Cantilever probes have a beam or arm structure that extends from a fixed base. They are often used for probing small and closely spaced features on a wafer.
Application: Cantilever probes are suitable for testing fine-pitch devices and for applications where precise positioning is required.
Vertical Buckling Probes:
Description: These probes have a unique design that allows for buckling in a controlled manner during contact. This design provides compliance and reduces the risk of damaging the wafer or probe tips.
Application: Vertical buckling probes are used in applications where controlled compliance is essential, such as when testing delicate or irregular surfaces.
Blade or Razor Probes:
Description: These probes have a thin, flat blade or razor-like tip. They are often used for contacting narrow or small test points on a wafer.
Application: Blade probes are suitable for applications where precision and minimal contact area are important.
Customized Probes:
Description: Manufacturers may produce customized tungsten probes based on specific requirements of the wafer testing process.
Application: Customized probes are designed for specific applications, addressing unique challenges or configurations.
The selection of a particular probe type depends on factors such as the size of the features being tested, the pitch between features, compliance requirements, and the overall testing environment.
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